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Home > CASE STUDIES > How Ultrafine Bubbles Clean Silicon Wafers

How Ultrafine Bubbles Clean Silicon Wafers

Cleaning results (ultra-pure water vs. ultra-fine bubbles)

After ultra-pure water jet cleaning 

超純水ジェット洗浄後10

1000 × magnification

超純水ジェット洗浄後1

3000 × magnification

After ultra-pure water + ultrafine bubble jet cleaning

超純粋ジェット洗浄後+ウルトラファインバブル洗浄後10

1000 × magnification

超純粋ジェット洗浄後+ウルトラファインバブル洗浄後

3000 × magnification

Quantitive comparison of cleaning results

Condition 

Residual particle area (μ㎡)

Before cleaning  359–472 μ㎡
After ultra-pure water cleaning  320–482 μ㎡
After ultra-pure water + UFB jet cleaning  28.65 μ㎡ / 37.33 μ㎡

Verified cleaning principle

We experimentally verified the cleaning effect by utilizing the high internal pressure of ultrafine bubbles. When the bubbles collapse, the resulting pressure waves removed fine particles from the solid surface. Particles larger than 1 μm were no longer observed after cleaning. As a result, the washable surface area increased, reaching 92%.

Cleaning principle of cleaning silicon wafer using ultra-fine bubbles(PDF)

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102 Grace Terada-cho
9-8, Kokubu-cho,
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543-0044

web@oknozzle.com

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