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Home > Mechanism of cleaning silicon wafer

Mechanism of cleaning silicon wafer

The result of cleaning with ultra fine bubbles

After ultra pure water cleaning

超純水ジェット洗浄後10
1000 magnification
超純水ジェット洗浄後1
3000 magnification

After ultra pure water + ultra fine bubble cleaning

超純粋ジェット洗浄後+ウルトラファインバブル洗浄後10
1000 magnification
超純粋ジェット洗浄後+ウルトラファインバブル洗浄後
3000 magnification

Results of cleaning

  After cleaning After ultra pure water cleaning After ultra pure water jet + ultra fine bubble cleaning
      picture of 1000 magnification picture of 3000 magnification
Square measure 359~472um2 320~482um2 28.65um2 37.33um2
  Cleaning rate due to ultra fine bubbles  : 92.13% as area ratio    

Experimentally validated the effect of removing particles on the solid surface by pressure waves, utilizing the characteristics of high pressure inside the ultra-fine-bubbles.
It became clear that particles above 1 micron were removed and no longer observed, and that the area percentage that could be washed reaches 92%.

 

Mechanism of cleaning silicon wafer(PDF)

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